TES 44 (Perkin Elmer 4400)
The VCT-1800 system can be configured with a fast cycle load lock, an array of sputtering sources, and multi pocket electron beam gun along with an ion source for etching and ion assisted deposition. The water cooled, RF bias, rotating substrate holder has a usable area of seven inches in diameter primarily designed for the R&D applications. The multitude of options available on the VCT system makes it one of the most versatile thin film deposition systems on the market today.
VCT 1800
TES has over 40 years of experience working with Temescal's thin film deposition systems. From the BJD 1800 to the FCE 4800 and all the systems in between, TES has rebuilt, upgraded and engineered custom and unique configurations that a large company such as Temescal cannot offer. By starting with a core system originally manufactured by Temescal and adding the flexibility that TES can provide you can have a system that meets the most stringent process requirements at a very reasonable price.
TEMESCAL (BJD/FCE/VES)
TES 600/900 (MRC 600/900)
The TES 600 (horizontal process) & TES 900 (vertical process) series sputtering systems offer a fast cycle dual level load lock capable of exchanging a completed 12” x 12” pallet load of substrates with a new pallet load allowing continuous operation. The pallet of substrates travel in a linear motion in front of up to three 5” x 15” magnetron cathodes. With the pallet scanning in front of the rectangular cathode the substrate deposition uniformity of +/-5% is achievable and target utilization is excellent. RF etch and substrate heating is in the process chamber.
Uptime RE-ENGINEERED
The Most Versatile Tools on the Market
The TES-44 series sputtering system is a fast cycle load locked, sputter down system with a water cooled, RF bias, rotating substrate table. This system is flexible enough for R&D but can be equipped for the high-capacity production environment as well. The many configurations that TES can provide offers a high level of flexibility to our customers. With typical film uniformity of +/- 5% and the flexibility to handle unique substrates, this system is one of the most versatile tools on the market today.
 TES-44 load lock sputtering systems ready for production. |
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 TES-44 series load lock sputtering systems |
 TES-44 series sputtering system configured with six magnetron cathodes. |
 TES-44 series sputtering system with ultra high rate deposition head. |
 TES-44 series sputtering system configured for eight inch diameter substrates. |
 VCT-1800 thin film deposition systems can be configured for through the wall installation. |
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 VCT-1800 thin film deposition system offers unmatched flexibility. |
 The Temescal BJD-1800 is a well-designed and cost-effective solution to many thin film process tool requirements. |
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 The Temescal BJD-1800 evaporator is simple to operate and maintain. |
 Temescal BJD1800 thin film deposition systems can be configured with many options beyond what the original equipment manufacturer provides. |
 A Temescal BJD-1800 system combined with TES automation allows the operator to start a complex recipe, monitor every step and log all data points by simply pressing the start button. |
 Temescal BJD-1800 evaporator is simple to operate and maintain. |
 TES-600 load lock sputtering system can be configured with an in process optical stress analysis system capable of monitoring film stress during the deposition process. |
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 TES-600 load lock sputtering system configured with a dual level load lock, three 5" x 15" magnetron cathodes, RF etch and substrate heating. |
 TES-900 load lock sputtering system offers a compact footprint. |
